SikaBond® TF Plus R

SikaBond® TF Plus R cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower.

Resistant to water, seawater, cement grout and water-dispersed detergents.

The substrate must be sound, homogeneous and no paint or other coatings must be present. It needs to be clean, dry and free from oils, grease, dust and loose or friable particles.
Surface treatment depends on the specific nature of the substrates and is important for a long lasting bond.
Treat non-porous surfaces with Sika® Aktivator-205. Clean porous surfaces by wire brush and / or vacuum cleaner. On porous substrates exposed frequently to water use Sika® Primer-210 or Sika® Primer-3 N. Consider that these suggestions are based on experience and have in any case to be verified by tests on original substrates.
Structured and metallic powder coatings has to be grinded with abrasive pad -very fine- and treated with Sika® Aktivator-205.

SikaBond® TF Plus R can be processed between 5 °C and 40 °C but changes in reactivity and application properties have to be considered. The optimum temperature for substrate and adhesive is between 15 °C and 25 °C. Until the adhesive is fully cured the substrate temperature must be in between 5 °C and 40 °C.
To avoid condensation on the surfaces, the temperature of the bonding substrates must be at least 3 °C higher than the dew point of the air.
The skin time is significantly shorter in hot and humid climate. The SikaMembran® sheet must always be installed within half of the skin time. Never join bonding parts if the adhesive has built a skin.
SikaBond® TF Plus R can be processed with manual, pneumatic or electric driven piston guns.

For detailed information about the application of SikaMembran® sheets consult Product Data Sheet “SikaMembran System".

Tooling and application of SikaMembran® sheet must be carried out within the skin time of the adhesive.
For detailed information about the application of SikaMembran® sheets consult Product Data Sheet “SikaMembran System".

Uncured SikaBond® TF Plus R can be removed from tools and equipment with Sika® Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® PowerClean wipes or a suitable industrial hand cleaner and water.

Do not use solvents on skin.

Where two or more different reactive process materials are used, allow the first to cure completely before applying the next.
The compatibility of gaskets, backer rods, and other accessory materials with SikaBond® TF Plus R must be tested in advance.
Do not use SikaBond® TF Plus R on natural stone or as a glazing sealant.
Do not use on PTFE (Teflon), Polyethylene (PE), Polypropylene (PP), Polystyrene (PS) and bituminous substrates, natural rubber, EPDM rubber from other producers or on any building materials which might leach oils, plasticisers or solvents that could degrade the product.
Do not mix with or expose uncured SikaBond® TF Plus R to substances that may react with isocyanates, especially alcohols which are often components within e.g. thinners, solvents, cleaning agents and formwork releasing compounds. Such contact could interfere or prevent the cross linking curing reaction of the material.

In the case of the plasterable SikaMembrane foil-variants, there should be as little excess adhesive on the substrate outside of the foil area, as adhesive protrusions are difficult to plaster over. If excess adhesive cannot be prevented, the surfaces should be masked with masking tape.